LineMaster Fusion 3D
LineMaster Fusion 3D provides high speed, inline sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface. With only a few minutes of training, an operator can perform accurate 3D measurements of solder paste pads, BGA's and many other PCB features. LineMaster's completely automatic solder paste measurement process eliminates operator errors and offers outstanding repeatability at an affordable price.Key Features & Benefits
- Solder Paste Height, Area,Volume, X-Y Registration, Bridging Measurements
- Color 3D Profiles for Qualitative Analysis
- Windows 10 Pro OS
- Two-Year, End-User Warranty with Technical Support
- PSI 1500 3D Camera Technology
- Onboard SPC Run Charts with Full Data Traceability
- 24″ x 24″ Inspection Area
- NIST Calibration Standard
- Hardware/Software Reference and Online Help
Specifications |
|
|---|---|
| Inspection Speed | .33 Sec./FOV |
| Height Accuracy | 1µm (0.04 mils) |
| Gauge R&R | <<10% (+/- 30% Tolerance) |
| Z Resolution | 0.20 µm (.008 mils) |
| Lateral Resolution (X-Y) | 8µm (.3 mils) / 4um optional |
| Minimum Paste Deposit | 51µm (2 Mils) |
