VisionPro M Series
The VisionPro M Series offers the flexibility of choosing either laser-based or structured white light sensor technology. Laser provides accurate cross sectional height measurements along with area and volume calculations through user defined regions. Structured white light offers the most comprehensive data set for true height, area, volume and realistic 3D renderings of the solder deposits. Packaged in a rugged, bench top platform designed for show, engineered for the most advanced measurement requirements found within the stencil printing process. Includes real-time, integrated SPC run charts, custom data reports and simple to use Gerber generated programs. The VisionPro M Series provides exceptional value for the budget conscious electronics manufacturer concerned with improving production yields.Key Features & Benefits
- Attractive Space saving Design
- Best in Class Gage R&R
- Measure Height, Area, Volume
- SPC Run Charts/Data Reports
- 3D – Qualitative Analysis
- Service Free USB Interface
- ZERO Cost Online Training
- Windows® 10
- Large ESD Safe Work Surface
- One -Year, End User Warranty
- High Resolution Color CCD Camera
- Dell® PC / 23″ LCD Monitor
- Optional Manual X-Y Stage
- Optional NIST Calibration Tool
Specifications |
|
|---|---|
| Inspection Speed | .33 Sec/FOV |
| Z Resolution | .48 μm (.019 mils) |
| Gage R & R (+/- 50% tolerance on PCB | <10% |
| Height Accuracy on Cal Target | 1 μm (.04 mils) |
| Minimum Paste Deposit Size (X,Y) | 51 μm (2 mils) |
